Mechanic Solder Paste Xp4 148 C
Mechanic XP4-148°C Solder Paste is a high quality solder paste for BGA (Ball Grid Array) component rework and reballing applications.
Characteristics:
Type: XP4
Quantity: 35g
Melting point: 148C°
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Mechanic XP4-148°C Solder Paste is a high quality solder paste for BGA (Ball Grid Array) component rework and reballing applications.
Characteristics:
Type: XP4
Quantity: 35g
Melting point: 148C°
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Mechanic XP4-148°C Solder Paste is a high quality solder paste for BGA (Ball Grid Array) component rework and reballing applications.
Characteristics:
Type: XP4
Quantity: 35g
Melting point: 148C°